Tapper Sealing Technology AB (TST)

Modelli inTapper Sealing Technology AB (TST) CatalogCable and Pipe entries - RUTSEAL® Metric
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Descrizione
Material: Chloroprene
Resistant to chemicals, ageing and weatherproof.

Suitable for holes in materials of 0,5 - 4mm thickness.
Quick and simple assembly without the use of tools.

Mode of protection:......................IP67 acc. to EN 60529
Temperature range:.....................-30°C....+100°C
Test standard:.............................EMKO TUI (03-SEC) FI 001/84
Semko report:.............................410375
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22
Aggiunto il
22 lug, 2009
Descrizione
Material: EPDM
Resistant to chemicals and weatherproof.

Suitable for holes in materials of 0,5 - 4mm thickness.
Quick and simple assembly without the use of tools.

Mode of protection:.....................IP67 acc. to EN 60529
Temperature range:....................-40°C....+110°C
Test standard:............................SEMKO 44:1984
Semko report:............................0211038/01-07
Colour:..............
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44
Aggiunto il
22 lug, 2009
Descrizione
Material: EPDM
Resistant to chemicals and weatherproof.

Suitable for holes in materials of 0,5 - 4mm thickness.

Quick and simple assembly without the use of tools.

Mode of protection:.....................IP67 acc. to EN 60529
Temperature range:....................-40°C....+110°C
Test standard:............................SEMKO 44:1984
Semko report:............................0211038/01-07
Colour:..........
Con tecnologia
SolidComponentsTM
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Sconosciuto
Download
51
Aggiunto il
22 lug, 2009
Descrizione
Material: EPDM
Resistant to chemicals and weatherproof.

Suitable for holes in materials of 0,5 - 4mm thickness.

Quick and simple assembly without the use of tools.

Mode of protection:.....................IP67 acc. to EN 60529
Temperature range:....................-40°C....+110°C
Test standard:............................SEMKO 44:1984
Semko report:............................0211038/01-07
Colour:..........
Con tecnologia
SolidComponentsTM
Configurazioni?
Sconosciuto
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23
Aggiunto il
22 lug, 2009

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